CION Modules™

The CION Module™/FXT192A was specifically developed for the integration in test fixtures. The module is based on GOEPEL electronic's custom CION ASIC ICs and the comprehensive analogue complex. The module enables extended JTAG/Boundary Scan test coverage for non JTAG/Boundary Scan digital circuit clusters and edge connectors and, additionally, multiple analogue tests and voltage measurements. Each digital channel can be independently programmed as input, output, bi-directional or tri-state. All test channels provide an increased driver current and “unstress” protection feature to avoid interface damages by extended fault-currents. The configuration of the analogue complex is wide-banded. Furthermore, the module provides extra resources for circuit voltage and triggering external actors/sensors e.g. switchers, LEDs, relays etc. The CION Module™/FXT192A is cascadable and can be hot-swapped.

The CION Module™/FXT96 is a test board providing 96 bi-directional test channels with programmable I/O voltage between 1.8V and 5V in three groups of 32 channels each. It has been designed for mixed-voltage applications using single-ended signal transmission. Each channel can be configured independently as input, output, bi-directional or in high-impedance state, driving/sinking up to 24 mA, and providing a special “unstress” feature to avoid interface destruction by high fault currents. Additionally, the module features hot-swap capability. An advantage over other solutions is that the module’s connection setup can be done either by wire-wrap or via 50-pin IDC cables. The design prepares for cascading multiple modules for configurations of more than 1000 I/O channels.

The CION Module™/SO-DIMM204-3, was especially developed for the test of 204-Pin DDR3 SO-DIMM interfaces compliant with JEDEC Std. (JESD 79-3C and JESD 21-C). The module is based on one GOEPEL electronic's custom CION ASIC IC and one single PLD. The module enables extended JTAG/Boundary Scan test coverage for all DDR3 interface signals including most of power and ground pins. Each 204-Pin SO-DIMM signal pin can be independently programmed as input, output, bi-directional or tri-state. The CION™ test channels provide an increased driver current and “unstress” protection feature to avoid interface damages by extended fault currents. Furthermore the CION Module/SO-DIMM204-3 is cascadable and can be hot-swapped.

The CION Module™/PCIe-x4 enables structural test coverage of PCI Express x4 slots via IEEE1149.1./6. The module is based on GOEPEL electronic's custom CION™ ASIC ICs coupled with differential test channels. The low-cost module is plugged directly into the tested PCI Express slot and controlled by means of a TAP (Test Access Port). Because of on-board IEEE1149.1 und IEEE1149.6 test channels all high-speed signal pins, low-speed signal pins and voltage supply pin of PCI Express 1.x and 2.0 compliant connectors are structurally testable.

The CION Module™/PCI32-64 has been designed as a configurable PCI card providing extended JTAG/Boundary Scan test capabilities of 3.3 V and 5 V targets (e.g. PC motherboards) including automatic voltage detection. Every PCI bus signal is programmable independently as input, output, bi-directional or in high-impedance state. Additionally, power and ground connections are covered. All test channels provide increased signal-current and “unstress” feature to avoid interface damage due to high fault-currents. Additionally, the module features hot-swap capability.