X-Ray Inspection (AXI)
3D X-Ray Inspection
A PCB is selectively radiated from different angles. Enabling the reconstruction of single layer as required.
Operational Fields
- In-line 3D X-ray inspection
- Inspection of double-sided assembled PCBs
- Qualitative inspection of all solder joints (e.g. BGA, QFN)
- Check for presence, mismatch and shorts
- Void measurement in various layers
- Inspection of complex PCBs with overlaid solder levels and mounted cooling devices
- Determination of capillary action in THT solder joints
Advantages of 3D X-Ray Inspection
- Safe inspection of double-sided assembled PCBs
- Reconstruction of any layers
- Fast and user friendly test program generation by using a single unified library
GOEPEL electronics Ltd., Unit 1A, The Old Granary, Westwick, Cambridge, CB24 3ARPhone +44-1223-858298, Fax +44-1223-257800, goepel.co.uk
